As the worldwide deployment of connected devices reaches 15 Billion in the next few years and up to 25 Billion by 2020 according to industry predictions, it is expected that an increasing percentage of these devices will be installed in locations that are subject to diverse environmental conditions. Intelligent systems and devices at the edge of the Internet of Things (IoT) must be designed to withstand temperature extremes, allowing for placement closer to the point of data collection.
Traditional applications for Industrial Temperature Systems such as Military and Aerospace, outdoor POI (Point of Information), Kiosks, Vending, Digital Signage, Security, Transportation (Bus, Rail, Marine, and Automotive), Energy (Production, Delivery, and Monitoring), all have an extremely low tolerance for field failure and downtime. Due to the critical availability requirement, systems built to address these markets must incorporate tested devices and components to be extremely reliable under all potentially adverse conditions. As a result, Acura Embedded Systems has developed a rigorous Wide Temperature Assurance Service to address this requirement at the board level. These products specifically meet the needs of computing applications in areas of extreme temperature variance.
By factoring thermal issues into the product development stage, Acura embedded board designers are able to develop thermally efficient industrial computing platforms that have a high tolerance for extreme temperature environments.
Acura’s Wide Temperature Assurance Service
For nearly two decades, Acura has designed and manufactured quality embedded products to address the needs of a multitude of industrial applications. The accumulated experience in all aspects of the embedded electronics market gives Acura a strong position in the development of wide temperature CPU boards and systems.
SBC Wide Temperature Design Considerations
With each new processor generation, increasingly dense chip circuitry is able to produce faster computations, at lower power requirements and at reduced manufacturing costs. Growing industry demands push the need to create thermally efficient computing enclosures that are both compact and fast cooling. At the development stage, thermal awareness guides engineers to select verified components that can operate under wide temperature variances. Designers must also find ways to resolve the issue of power consumption and heat generation in successive processor generations and smaller board form factors. Introducing devices such as heat sinks or heat-spreaders is also a good way to deal with system heat.
Thermal Testing System
By using a Natural Convection Chamber or a Rapid Rate Thermal Cycling Chamber to create atmospheric conditions similar to those actually found in an industrial application setting, very reliable in-house results can be obtained as to the real-world thermal tolerances in industrial situations.
Certifying Extended Temperature Systems
Devices in the commercial temperature range of 0°C to 40°C are not suitable for extended temperature applications. For system integrators who are looking to build products that can withstand high-temperature extremes, can choose Acura certified wide temperature boards, which are tailored for harsh environments. By doing so, customers can be assured these products will be able to perform as expected within the tested functional temperature range.